ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,853, issued on Nov. 3, was assigned to Micron Technology Inc. (Boise, Idaho). "Molded memory assemblies for a system in package semiconducto... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,854, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taoyuan City, Taiwan). "Power chip package structure" was inve... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,856, issued on Nov. 3, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada). "Lid as... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,857, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module with shaped external contact for... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,858, issued on Nov. 3, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Semiconductor device with an embedded active devi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,859, issued on Nov. 3, was assigned to INTEL FOUNDRY IP LLC (Santa Clara, Calif.). "Three-dimensional stack cooling wings" was invented by S... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,860, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package on package structure with enc... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,861, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Memory on package (MOP) architecture" was invented by Eng Huat Go... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,862, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Zigzag wired memory module" was invented by Jo... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,863, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stacked dies coupled by a th... Read More